The first ceramic-based,polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or watercooling solutions. Enough compound to cover at leat 25 to 35 small CPU cores,or 9 to 15 large CPU cores,or 4 to 8 heat plates. A layered composite of aluminum oxide and boron nitride to provide near silverIII level performance A pure electrical insulator,neither electrically conductive nor capacitive Does not contain any silicone.The suspension fluid is a proprietary combination of advanced polysynthetic oils The first thermal compound engineered for controlled triple phase viscosity